| No. |
Item
|
Specification
|
| 1 |
Certificate |
ISO9001:2008+ISO14001:2004, UL, Sira Certification, ROHS |
|
2
|
Layer |
1~18 layers |
| 3 |
Available bas material
type
|
Halogen free; High TG(tg150, tg170, tg 180); High CTI(CTI>600V),
High copper(8 oZ); High layer; Rogers; Arlon; Nelco; Taconic; Teflon;
HDI; PTFE, CEM-1; CEM-3
|
| 4 |
Surface treatment |
HASL, Gold plating, Immersion gold, Immersion tin, Immersion silver,
Gold fingers(hard gold), OSP |
| 5 |
Max. PCB dimensions |
23 x 35 inches (584.2 x 889.0mm) |
| 6 |
PCB thickness |
8.27~275.8mil (0.21~7.0mm) |
| 7 |
Max. copper weight |
6 oZ |
| 8 |
Solder mask bridge
between solder dam
|
4 mil (0.10mm) |
| 9 |
Min annular & Min
thickness solder mask
|
1.5 mil (0.038mm) & 0.40mil (10um) |
| 10 |
Soldermask colors |
Green, yellow, black, blue, matte, transparence LPI solder mask and
peelable solder mask
|
| 11 |
Min trace width & Min
trace space
|
3 mil (0.076mm) & 3mil (0.076mm) |
| 12 |
Min space between trace
to pads, pads to pads
|
3 mil (0.076mm) |
| 13 |
Max. aspect ratio |
1:20 |
| 14 |
Data format |
GERBER, PROTEL, PADS2000, Powerpcb, ODB++ |
| 15 |
Electric test |
100% E-test high voltage test |
| 16 |
Special techniques |
Blind and buries vias (min holes size is 0.2mm), high layer with heavy
copper
|
| 17 |
Quotation service &
Engineering support
|
24 x 7 hours |
| 18 |
Delivery time |
1~4 WD for quickturn; 4~9WD for normal turn |
| 19 |
Available shipment |
DHL, FEDEX, UPS, etc, by air or by sea for your choose |